Global Data Center Liquid Cooling Market | Asetek, Rittal, Fujitsu, Vertiv Holdings Co., Submer

                                                                              

According to recent market research "Data Center Liquid Cooling Market by Component (Solution and Services), End User (Cloud Providers, Colocation Providers, Enterprises, and Hyperscale Data Centers), Data Center Type, Type of Cooling, Enterprise and Region - Global Forecast to 2027", published by MarketsandMarkets, the global data center liquid cooling market is projected to grow from USD 2.1 billion in 2022 to USD 6.4 billion by 2027, at a CAGR of 24.8% during the forecast period. Major factors driving the growth of the data center liquid cooling market include increasing need for energy-efficient cooling solutions, growing demand for compact and noise-free solutions, need for lower operating costs, and need for better overclocking potential. The emergence of advanced technologies such as AI, blockchain, and other and cooling requirements in low-density data centers are expected to provide a significant opportunity for market growth.
 
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The services segment, by component of the data center liquid cooling market is projected to be the fastest-growing segment during 2022 to 2027. Data center liquid cooling solutions require customized design and need to be free from product design overheads of heat transfer systems, which is the primary reason for growth of services segment.

The small and mid-sized data center, by size segment of data center liquid cooling market is projected to be the fastest-growing segment during 2022 to 2027. Small and mid-sized data centers are low-density data center servers due to which they are adopting indirect liquid cooling solutions, such as cold plates, which is driving the growth of this segment.

The hyperscale data center, by end user segment of data center liquid cooling market is projected to be the fastest-growing segment during 2022 to 2027. Hyperscale data centers are significantly larger than corporate data centers, and they outperform corporate data centers mainly due to customized engineering and economies of scale.

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The global data center liquid cooling market is projected to grow from USD 2.1 billion in 2022 to USD 6.4 billion by 2027, at a CAGR of 24.8% during the forecast period. Major factors driving the growth of the data center liquid cooling market include increasing need for energy-efficient cooling solutions, growing demand for compact and noise-free solutions, need for lower operating costs, and need for better overclocking potential. The emergence of advanced technologies such as AI, blockchain, and other and cooling requirements in low-density data centers are expected to provide a significant opportunity for market growth.

Companies such as Asetek (Denmark), Rittal (Germany), Fujitsu (Japan), Vertiv Holdings Co. (US), Green Revolution Cooling Inc. (US), Submer (Spain), Midas Green Technologies (Austin), Schneider Electric (France) fall under the winners' category. These are leading players in the data center liquid cooling market, globally. These players have adopted the strategies of expansions, agreements, new product development, partnerships and acquisitions, to fulfill the rising demand for face masks on the regional as well as global levels.

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In March 2021, Submer launched its latest solution, the MegaPod. The MegaPod is the company's latest step in its journey to revolutionize the data center industry and help it to become more efficient and sustainable.

In March 2021, Vertiv Holdings Co. introduced Liebert VIC, its first liquid immersion cooling solution for high density data centers. The solution was developed in partnership with Green Revolution Cooling, the leader in single-phase immersion cooling for data centers.

In February 2021, Schneider Electric announced the launch of a liquid cooled, EcoStruxure modular data center, all-in-one module. Integrated by Avnet and containing chassis-level precision immersion cooling from Iceotope, the new prefabricated module will allow the most CPU and GPU-intensive high-performance computing (HPC) edge applications to be deployed with greater reliability in harsh and remote environments.

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